RoHS Compliance of SMD Components for Pb-free Smoldering

KEKO VARICON introduced RoHS compliant SMD ceramic body components with barrier type end terminations suitable for Pb-free reflow soldering according to JEDEC standard J-STD-020C. These components encompass :

• varicons - MLV Series ZV, AV, AVY, ZVE, ZVX, ZVY and DV
• capacitors - MLC Series C
• dual function varicons - Series MV and OV.

►	Type Designation Letter N at the end of type designation us used ZVE 14 S 0603 N R1 ZV 14 K 0805 121 N R1 AV 20 K 1812 801 N R1 ZVX 30 S 1206 400 N R1 DV 130 K 3225 N R1 C 150 nF K X7R 631 2220 N R1 MV 20 K 105 MZ 1210 251 N R1 OV 30 K 155 MZ 1812 801 N R1
►	Labeling All RoHS compliant SMD components are designated : with ‘RoHS Compliant’ in Order Confirmation with ‘RoHS Compliant’ in Dispatch Note with yellow adhesive tape with inscription ‘Pb-free’ on the package unit and outer boxes
►	Smolderability and Resistance to Soldering Heat reflow soldering test according to JEDEC standard J-STD-020C for Pb-free solders and soldering test by dipping according to IEC 60068-2 for Pb-free solders.
►	Pb-free Reflow Soldering Profile Recommendations Recommended soldering profiles for all above components are in accordance with JEDEC standard curves (J-STD-020C) and therefore compatible with existing SnPb reflow process and new Pb-free reflow process.

Soldering Conditions

Solder Material	Pb free ( SnAgCu or SnCu with melting point at 217 oC) or Sn62 / 36 Pb / 2 Ag ones
Flux	Non-activated (R), flux whenever possible Mildly activated (RMA) fluxes of class L3CN; class ORLO
Solder paste thickness	100 – 300 µm
Soldering Profile	Tpeak < 250 °C, time at T > 217 °C not longer than 40 s
Recommended peak soldering temperature	235 +/-5 °C

Pad size

Size	L (mm)	W (mm)	A (mm)	B (mm)	C (mm)	D (mm)
0603	1.6 +/-0.20	0.8 +/-0.10	1.0	1.0	0.6	2.6
0805	2.0 +/-0.20	1.25 +/-0.15	1.4	1.2	1.0	3.4
1206	3.2 +/-0.30	1.6 +/-0.20	1.8	1.2	2.1	4.5
1210	3.2 +/-0.30	2.5 +/-0.25	2.8	1.2	2.1	4.5
1812	4.5 +/-0.35	3.2 +/-0.30	3.6	1.5	3.0	6.0
2220	5.7 +/-0.40	5.0 +/-0.40	5.5	1.5	4.2	7.2
3225	8.0 +/-0.50	6.3 +/-0.40	6.8	1.5	6.5	9.5
4032	10.0 +/-0.50	8.0 +/-0.40	6.8	1.5	8.7	11.7

Soldering Conditions

Soldering Meniscus Size

Chip 0603, 0805, 1206	Chip 1210, 1812, 2220