| ► | Labeling Differentiation between non-Pb-free components and Pb-free ones will be made in the documents and on package units:
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| ► | Type designation KEKO VARICON will not change type designation of RoHS compliant types with respect to those which are not. Only labelling will be different as described below. |
| ► | Pb-free Wave Soldering Profile Recommendations Recommended soldering profiles for all above components are in accordance with JEDEC standard curves (JES D22 – B106C) and therefore compatible with new 270 °C Pb-free process. |
| ► | Resistance to Soldering Heat In order to prevent any potential problems KEKO VARICON decided to introduce its own internal standard for testing of resistance to soldering heat of through-hole components : 300 °C ,10 s. |
| Parameter | Symbol | Specification |
| Preheating temperature gradient | 4 °C/s max. | |
| Preheating time | t1 | 2 to 5 min |
| Min. preheating temperature | T1 | 130 °C |
| Max. preheating temperature | T2 | 180 °C |
| Melting temperature / point | tmelt | 217 °C |
| Time in wave soldering phase (w1+w2) | tw1+w2 | 10 s |
| Max. wave temperature (w1+w2) | T3 | +0/-5°C |
| Cooling temperature gradient | 6 °C/s max. | |
| Temperature jump from T2 to T3 (w1) | T3(w1)-T2 | 120 °C max. |
| Time from 25 °C to T3 (wave temp.) | 8 min max. |